Electronics Forum: electronic assembly (Page 474 of 599)

QFN's and LGA's

Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge

Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value

Electrically-Conductive Tapes application advice?

Electronics Forum | Sun Aug 02 19:47:16 EDT 2009 | isd_jwendell

Now that I've seen the pics... Soldering could work just fine. If you are going for large production then you could get copper discs cut and mounted in tape carrier ($$). This would make it very easy for automated equipment to assemble. Mounting a

AOI Sony vs Orbitech

Electronics Forum | Sun Aug 09 09:48:19 EDT 2009 | orproadamshaw

I'd like to correct a few of the points made above. Orbotech have sold their Assembly business to Orpro Vision GmbH, we are based in Germany, where we developed the Vantage S22, Symbion S36 and their predecessors the VT / Trion series. Both Develop

Vapour phase soldering - problem

Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad

One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,

Minimum Tg for LeadFree board.

Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo

Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’

Low Silver Solder Problems

Electronics Forum | Thu Aug 27 13:14:49 EDT 2009 | ghepo

I have already told you that is not possible solve this problem by e-mail, without perform a detailed failure analysis. Also I have told you to procede by exclusion. Are you sure, by tests, regarding the PCB quality ? Are you sure regarding the solde

ionic residues on the surface of printed circuit assemblies

Electronics Forum | Mon Aug 31 21:47:56 EDT 2009 | davef

In response to your question: 3 Saponifier / non saponifier 3a Saponifiers: * Aqueous Technologies: PCB-Wash http://www.aqueoustech.com * Kyzen: XJN http://www.kyzen.com * EnviroSense: Enviro Gold #816 http://www.envirosense-inc.com 3b Non-Sapo

Lead Free Immersion SIlver PCB-->Creeping Corrosion

Electronics Forum | Thu Sep 03 12:03:52 EDT 2009 | Sean

Hi All, I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion? 2) I heard that lead fr

QSTATS at HP3070 Series 3

Electronics Forum | Tue Sep 08 20:32:55 EDT 2009 | juanv

Hi, This is the firstime that I'm working with a HP 3070 Series 3 ICT. We ran the first assemblies and I would like to know where could I find all the information about this first article run. Fist of all, I need to know how could I visualize at

BGA failure after coating

Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef

We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate


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